Showcasing Packaging Solutions in APAC Events: BOBST Packaging and SEMICON SEA

DIC Graphics Thailand and DIC Compounds Malaysia recently showcased their innovations at two significant industry events in Asia Pacific. At BOBST’s “Next Frontier in Packaging” event in Bangkok, DIC Graphics highlighted the latest advancements in packaging technology. Similarly, DIC Compounds Malaysia presented their conductive material solutions at SEMICON SEA 2024 in Kuala Lumpur. These exhibitions provided excellent platforms to connect with industry peers, potential clients, and partners. 

DIC Graphics Thailand at BOBST Thailand’s Southeast Asia Pacific Packaging Event – The Next Frontier in Packaging 

On June 27th and 28th, 2024, DIC Graphics Thailand had the privilege of participating in BOBST’s “Next Frontier in Packaging” event, held at the Millennium Hilton in Bangkok. This two-day event, hosted by one of our key industry partners, BOBST, was a significant opportunity to showcase the latest advancements in packaging technology and innovation. 

Event Highlights: 

• BOBST Thailand Launch & Press Conference in APAC: Attendees witnessed the introduction of BOBST’s cutting-edge innovations tailored for the APAC market. 

• Exploring Market Trends: Insights into the latest trends in flexible packaging were shared, providing a comprehensive overview of industry advancements. 

• Panel Discussion on Flexible Packaging: Our representative, David Robins, Regional Marketing Manager in AP Flexo Inks, participated in a panel discussion, sharing valuable insights on the future of flexible packaging. 

Key Points from the Panel Discussion by David Robins, Regional Marketing Manager AP, Flexo Inks: 

• Sustainability Landscape with the 5Rs Framework: David Robins discussed DIC’s commitment to sustainability through the 5Rs framework, guiding the company’s future roadmaps and operational activities. 

• Mono-Material Packaging Solutions: Innovative solutions such as BOPE/LLDPE with oxygen barrier adhesives and coatings, heat-resistant coatings, bio-mass/bio renewable ink, and polyolefin film (DIFAREN ®) were highlighted. 

• Mono-Material Laminate MDOPE/PE: The potential of oneBARRIER for luxury packaging, for e.g. mixed nuts and robusta coffee. 

• Deinking Technology: The beneficial impacts of deinking on packaging sustainability

DIC Compounds Malaysia Showcases Product Solutions at SEMICON SEA 2024 

From May 28th to 30th, 2024, DIC Compounds (M) Sdn Bhd (DCM) proudly showcased conductive material solutions at SEMICON SEA 2024, held at MITEC, Kuala Lumpur.  

The event provided an excellent platform for connecting with industry peers, potential clients, and partners.

Why Join SEMICON? 

Besides networking with other industry professionals, DCM aimed to expand its product reach by promoting their profile and product – and assisting customers in understanding DIC’s role as their Total Packaging Solutions Partner. Additionally, this event gives DCM an opportunity to connect with semiconductor supply chain manufacturers – thereby helping them continue developing new solutions and establish a new pillar business. 

Looking ahead, DIC APAC is eager to participate in more exhibitions to continue showcasing its innovations and building valuable industry connections. Stay tuned for updates on our future events and initiatives!